Custom Peel-N-Place™ Arrays are pre-loaded polyester dome carriers backed with pressure sensitive adhesive tape. Typical tape material thicknesses used are 0.002”, 0.003”, and 0.004”.
Arrays are assembled with the dome style and quantity of your choice, cut to the size and shape you specify. Different sizes, shapes, and forces of metal domes can be placed on the same array. For electronic applications that require high actuation forces, intentional STACKED metal domes (two domes per position) are available.
The standard carrier material is polyester but this can be altered to fit your needs. Placement of the array is quick and easy. Simply peel off the backing, align the array and apply it to your circuit board or membrane. Since all of the domes are placed simultaneously, production time is greatly reduced. Your quality also benefits from the use of our custom arrays which reduces the chances of “double domes” and dome placement errors.
Our Custom Peel-N-Place™ dome arrays are manufactured entirely in Windsor, Colorado, to our precise specifications to ensure that you receive the highest quality product with consistent characteristics every time you order.
Snaptron offers custom placement fixtures for easier, more accurate placement of Snaptron metal dome arrays. Custom Peel-N-Place fixtures are affordable, more accurate than visual alignment, and make placing arrays a snap.
In order to start the process of designing a Custom Peel-N-Place™ array, here’s what we need from you:
- A drawing / print of what the part will look like. Please include overall size, dome part number(s), locations of domes and cutouts.
- Estimated annual usage of the part.
We can accept a number of different file types, but we can also provide budgetary pricing from a hand-sketch of the part. Following is a list of file types we support:
- AutoCAD (all versions)
- DXF (all versions)
- Solidworks (all versions)
- Inventor (.ipt)
- Solid Edge (.par)
- IGES (all versions)
- STEP (all versions)
- ACIS (.sat)
- Parasolid (all versions)
- Catia Graphics (.cgr)
- STL (.stl)
- VDASF (.vda)
- Acrobat (.pdf)
Shielding options for PNP dome arrays are available to help eliminate EMI/RFI interference, including:
- An additional film applied to the top layer of the array sheet.
- Domes applied directly to the shield using adhesive.
- Shield can be printed directly onto the array using conductive ink.
Packaging custom Peel-N-Place™ arrays:
Custom Peel-N-Place™ Array Sheets are pre-loaded polyester dome carriers backed with pressure-sensitive adhesive. The standard carrier is polyester, but this can be altered to fit your needs. Our array sheet design lends itself well to low and medium volume applications, where cost savings is critical during the board assembly process.
Note: Standard sheet format sizes available are: 5.3″ x 4.5″, 7″ x 8″. For information about custom sizes, please contact Snaptron.
Placement of the Peel-N-Place™ arrays is quick and easy. Simply peel off the release liner, align the array and apply it to your circuit board, flex circuit, or membrane. Snaptron also offers CUSTOM FIXTURES to assist you in the placement process. Two 4-leg domes can also be STACKED in a single position to double actuation force. By placing all of the domes simultaneously, production time is greatly reduced. Your quality also benefits from the use of our custom arrays which eliminate “double domes” and dome placement errors.
Upload your custom design
pdf, jpg, jpeg, gif, png, and bmp files can be uploaded using the form below. All other files types should be emailed to firstname.lastname@example.org.